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Products
The products listed here are for overseas markets, not for Japan domestic.
- Information Equipment / Software
- Industrial PC
- (discontinued) CONTEC Fanless Embedded PC BX-S3000
Versatile Box Computer for Embedded Applications
Embedded Fan-Less System with Intel 6th Skylake Platform
Fanless Embedded PC
Model:
BX-S3000
Maker:
CONTEC Co., Ltd.
Features
- Intel® 6th Skylake Platform
- Silent fanless design with high airtight chassis
- A4 Small design and cost effective
- Dual Giga LAN, 4x COM, 4x USB 3.0, 2x USB 2.0, 1x GPIO, 1x DVI-I, 1x DP and other rich expansion interface
- Wide range DC inpute
Specifications
Software Support
| Supported OS | Windows 10 IoT Enterprise 2019 LTSC 64-bit; Windows 10 IoT Enterprise LTSB 2016 64-bit; Windows 8.1; Windows 7 |
|---|
Core System
| CPU Generation (Development code) | 6th Gen. (Skylake-S) |
|---|---|
| Processor | Core i7-6700TE; Core i5-6500TE; Celeron G3900TE |
| CPU socket | LGA1151 |
| Memory | 32GB; 16GB; 8GB |
| RAS | Hardware monitor (Temperature / Voltage); Watchdog timer |
| GPU | – |
| AI Performance | – |
| Security | – |
Interface
| Video | 1x DisplayPort; 1x DVI-I |
|---|---|
| LAN | 2x 1000BASE-T |
| Wireless | – | Audio | 1x Line out; 1x Mic-in |
| I/O | 4x USB3.2 Gen1 (USB3.0); 2x USB2.0; 3x RS-232C; 1x RS-232C/422A/485 |
| Memory card | – |
Expansion Slot
| Expansion bus | M.2 socket; 1x Mini PCI Express; – |
|---|---|
| Drive bay | 2x 2.5-inch bay (SATA) |
Power
| Input voltage | 12 to 24VDC |
|---|
Dimensions / Weight
| Physical dimensions | 235(W) x 185(D) x 74(H) mm (No protrusions) |
|---|---|
| Weight | 3.0kg |
Environment
| Operating temperature | 0 to 50°C (32 to 122°F) (w/ 0.7m/s airflow w/ standard temp. SSD); 0 to 40°C (32 to 104°F) (w/ 0.7m/s airflow w/ standard temp. HDD) |
|---|---|
| Storage temperature | -10 to 60°C (14 to 140°F) |
| Standards & Certifications | CE; FCC Class A; VCCI Class A |
Related Article
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