CONTEC Box computer BX-M4600 -Fanless Embedded PC / Intel 13th Gen.(Raptor Lake) / 2x PCIe(x8) / DC Power Supply BX-M4600P2-G

Intel® R680E Chipset to support Intel® 13th Gen. LGA-1700 CPU (TDP 35W). 2 x 2.5” storage (up to 2.5 TB each) devices with RAID 0,1 supported

Box computer BX-M4600 -Fanless Embedded PC / Intel 13th Gen.(Raptor Lake) / 2x PCIe(x8) / DC Power Supply

Model:

BX-M4600P2-G

Maker:

CONTEC Co., Ltd.

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Features

Intel® R680E Chipset to support Intel® 13th Gen. LGA-1700 CPU (TDP 35W)
2 x 2.5” storage (up to 2.5 TB each) devices with RAID 0,1 supported
Includes M.2 slots for Wi-Fi and WWAN+GNSS with SIM, plus PCIe(x8) slots, offering various expansion interfaces.
Dual RJ45 Ethernet ports (2.5Gbps), 4 x USB 3.2 , 2 x USB 2.0, display Port 1.4 and DVI-I.
Security by TPM2.0, Wide range DC input

Specifications

System specifications

Item	Specifications
MODEL NAME	BX-M4600P2 / BX-M4600P2A
CHIPSET	Intel® R680E
BIOS	AMI UEFI BIOS
MEMORY	2 x 262-pin DDR5 4800MHz SO-DIMM socket, up to 32GB ECC & 64GB Non-ECC
STORAGE I/F	2 x 2.5″ HDD/SSD Removeable Bay by SATA III (6.0Gb/s) connector 1 x M.2 Key M 2242/2260/2280, support Intel RST, PCI-e x4 mode SSD
EXPANSION SLOT	BX-M4600P2-xxx：PCIe(x8) slot×2 BX-M4600P2A-xxx：PCI slot×2
WATCHDOG TIMER	Hardware Reset, 5~255 seconds/ 5~255 minutes
HARDWARE MONITORING	System monitor(Voltage, Fan Speed and Temperature)
EXPANSION INTERFACE	1 x M.2 Key E 2230, support WiFi module 1 x M.2 Key B 3042/2242/2260/2280, support WWAN+GNSS with SIM card slot & SSD (SATA)
AUDIO	MIC-In, line-out
ETHERNET	Dual RJ45 connector (front I/O) 2 x 10/100/1000/2500 Mbps Ethernet port by Intel i226 controller
SERIAL PORT	1 x RS232/422/485 DB-9P (Selected by BIOS) (Rear I/O) 3 x RS232 DB-9P (Rear I/O)
USB PORT	4 x USB3.2 Gen2 (front I/O) 2 x USB2.0 (front I/O)
GPIO	Non-isolated 6-bit GPIO+POWER switch signals by D-SUB 9P (Rear I/O)
DISPLAY INTERFACE	1 x Display Port1.4 (up to 4096 x 2160 @ 60Hz) 1 x DVI-I port on rear I/O, support DVI-D & VGA signal (up to 1920 x 1200 @ 30Hz)
POWER MANAGEMENT	Power On by Ring/ Wake on LAN function (setting from BIOS)
MOUNTING	Wall mount kit
DIMENSIONS (W x D x H)	235(W)×185(D)×129.5(H) (No protrusions)
POWER SUPPLY	Rated input voltage 12 – 24VDC Input voltage range 9 – 36VDC Over Voltage Protection 39VDC Setting
ENVIRONMENT	Operation Temperature Core i3 SKU 0°C to 50°C with Air Flow 0.7 m/s (w/ Wide Temp. SSD) 0°C to 40°C no Air Flow 0.7 m/s (w/ Wide Temp. HDD) Operation Temperature Core i5/ i7 SKU 0°C to 55°C with Air Flow 0.7 m/s (w/ Wide Temp. SSD) 0°C to 45°C no Air Flow 0.7 m/s (w/ Wide Temp. HDD) Storage Temperature -10 to 60°C Humidity 10 to 90% non-condensing
OS DRIVER SUPPORT	Windows®10 IoT Enterprise LTSC 2021 64 bit
CERTIFICATE	CE / FCC (Class A ) / VCCI / UKCA / BIS / RoHS2.0

Ordering guide

Model No.	CPU	Memory	Expansion slot
BX-M4600P2-G3200000	Corei3-13100TE	8GB DDR5 4800 Non-ECC	2x PCIe(x8) slot
BX-M4600P2-G5200000	Corei5-13500TE	8GB DDR5 4800 Non-ECC	2x PCIe(x8) slot
BX-M4600P2-G5300000	Corei5-13500TE	16GB DDR5 4800 ECC	2x PCIe(x8) slot
BX-M4600P2-G7300000	Corei7-13700TE	16GB DDR5 4800 ECC	2x PCIe(x8) slot
BX-M4600P2A-G3200000	Corei3-13100TE	8GB DDR5 4800 Non-ECC	2x PCI slot
BX-M4600P2A-G5200000	Corei5-13500TE	8GB DDR5 4800 Non-ECC	2x PCI slot
BX-M4600P2A-G5300000	Corei5-13500TE	16GB DDR5 4800 ECC	2x PCI slot
BX-M4600P2A-G7300000	Corei7-13700TE	16GB DDR5 4800 ECC	2x PCI slot

Inquiry

Intel® R680E Chipset to support Intel® 13th Gen. LGA-1700 CPU (TDP 35W). 2 x 2.5” storage (up to 2.5 TB each) devices with RAID 0,1 supported

Features

Specifications

System specifications

Ordering guide

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