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SHASHIN KAGAKU Wafer mapping film thickness measurement unit

Wafer Mapping Unit: Automatic, reliable film thickness mapping for up to 300 mm wafers, ideal for semiconductor manufacturing with self-calibration and cleanliness.

The wafer mapping unit is capable of automatically mapping film thickness measurement over the entire surface of wafers up to 300 mm. The automatic alignment function, self-calibration function, and high flatness wafer chuck enable highly reliable film thickness measurement. This unit is used in combination with the compact film thickness monitor.

It can be installed at the load port of semiconductor manufacturing equipment to control the film thickness on the manufacturing equipment while maintaining cleanliness.

Automatic wafer Mapping Device

Maker:

Shashin Kagaku

Application

 

Example of measurement data


 

 

Configuration


Specification

 

Specification
Installation type Stand-alone
Target substrate 100 mm, 125 mm, 150 mm, 200 mm, 300 mm Wafer with film
Light source Selectable below 3 kinds
・ Deuterium Halogen lamp
・ Halogen lamp
・ White color LED
Measurement distance  Max 60 mm
Beam spot  About 3 mmø (Option 1 mmø, but in case, it enables to do alignment)
Film thickness range  10 nm – 50 nm
Max film layer  Max 9 layers
Repeatability  ≦ 0.1 nm
Analysis  Curve fitting method
FFT method
Peak detection method
Measurement time  ≦1 sec/point
Data transfer  USB 2.0 Cable
・ For data input
・ For Stage control
Power  Notebook PC                   100-240 VAC Max 2A

Main Body                       100-240 VAC Max 2A

Automatic stage part     100-240 VAC Max 2 A

Weight  Notebook PC                about 3 kg

Main body                     about 4 kg

Automatic stage part   about 20 kg

Measurement  Main body (L) about 150 x (W) 160 x (H) 110 mm

In case of Deuterium Halogen lamp use
Stage part (L) about 500 x (W) 340 x (H) 270 mm

Automatic stage spec  Linear stage     Moving area:300 mm           Resolution:4μm       Max speed:40 mm/sec.
Rotating stage Moving area:2-400 degrees Resolution:0.005°    Max speed:30°/sec.
PC transmit       RS-232C (USB cable)
Monitor display  Display film thickness on real time basis
Mapping measurement result on graph display
Statistic calculation result display

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