CONTEC Fanless Embedded PC / Core i + Q170 (Skylake) / 2 x 2.5-inch drive bays BX-S3000 | Singapore Nihon Denkei Co.,Ltd.
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CONTEC Fanless Embedded PC / Core i + Q170 (Skylake) / 2 x 2.5-inch drive bays BX-S3000

Versatile Box Computer for Embedded Applications

CONTEC Fanless Embedded PC / Core i + Q170 (Skylake) / 2 x 2.5-inch drive bays

Model:

BX-S3000

Maker:

CONTEC Co., Ltd.

Feature

  • Intel® 6th Skylake Platform
  • Silent fanless design with high airtight chassis
  • A4 Small design and cost effective
  • 2x Giga LAN, 4x COM, 6x USB, 1x DVI-I, 1x DP
  • Wide range DC input
  • 2x PCI slots model and 2x PCI Express model available

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